Centamil Launches Hayagreeva HEx 5,000W Cooling Plate for AI

Centamil has introduced the Hayagreeva HEx, a 5,000W cooling plate designed to manage the extreme heat generated by next-generation artificial intelligence silicon. The Abu Dhabi-based company announced the product on May 28, 2026, positioning it as a solution for the thermal challenges facing modern data centers. Validated to remove over 5,000W of continuous heat, the plate is intended for direct-to-chip liquid cooling systems.

The Hayagreeva HEx features a rated thermal resistance of 0.005 °C/W, a metric that indicates high efficiency in transferring heat away from high-performance processors. As AI models grow in complexity, the power consumption of individual chips has increased significantly, pushing traditional air-cooling methods to their physical limits. This technology addresses the requirement for more aggressive thermal management in high-density computing environments.

Strategic Shift Toward Liquid Cooling

The launch of this 5,000W cooling plate coincides with a broader industry transition toward liquid-based thermal solutions. Vertiv also expanded its liquid cooling portfolio this week with the CoolChip CDU 2300, targeting data center operators in the EMEA region. These developments suggest that infrastructure providers are moving away from air cooling as the primary method for sustaining AI workloads.

For data center strategists, the adoption of high-capacity cold plates like the Hayagreeva HEx is becoming a necessity rather than an option. The ability to handle 5,000W per chip allows for greater rack density, which can reduce the physical footprint of AI infrastructure while maintaining operational stability. This efficiency is critical for organizations looking to scale their compute capacity without massive facility expansions.

Centamil's entry into the thermal management market highlights the growing importance of specialized hardware in the AI supply chain. While much of the focus remains on the chips themselves, the infrastructure required to keep those chips functional is a major area of investment. The Hayagreeva HEx is a step toward standardizing liquid cooling for the most demanding enterprise AI applications.

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Strategic Shift Toward Liquid Cooling

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